(Ebook PDF) Embedded Mechatronic Systems Volume 2 Analysis of Failures Modeling Simulation and Optimization 2nd Edition by Abdelkhalak El Hami, Philippe Pougnet 0081019564 9780081019566 full chapters

Embedded Mechatronic Systems, Volume 2: Analysis of Failures, Modeling, Simulation and Optimization 2nd Edition by Abdelkhalak El Hami, Philippe Pougnet – Ebook PDF Instant Download/DeliveryISBN:   0081019564, 9780081019566 

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Product details:

ISBN-10 :  0081019564 

ISBN-13 :  9780081019566

Author : Abdelkhalak El Hami, Philippe Pougnet 

Embedded Mechatronic Systems 2: Analysis of Failures, Modeling, Simulation and Optimization presents advances in research within the field of mechatronic systems, which integrates reliability into the design process. Providing many detailed examples, this book develops a characterization methodology for faults in mechatronic systems. It analyzes the multi-physical modeling of faults, revealing weaknesses in design and failure mechanisms. This development of meta-models enables us to simulate effects on the reliability of conditions of use and manufacture.

Embedded Mechatronic Systems, Volume 2: Analysis of Failures, Modeling, Simulation and Optimization 2nd Table of contents:

1: Highly Accelerated Testing
Abstract
1.1 Introduction
1.2 Load characteristics of the Super HAT equipment
1.3 Description of the Super HAT system
1.4 Application
1.5 Conclusion
2: Aging Power Transistors in Operational Conditions
Abstract
2.1 Introduction
2.2 Aging microwave power electronic components under operational conditions
2.3 Application to the study of microwave power transistors
2.4 Conclusion
3: Physical Defects Analysis of Mechatronic Systems
Abstract
3.1 Introduction
3.2 Equipment and methodology for analyzing failure in mechatronic systems
3.3 Analysis of physical defects
3.4 Conclusion
4: Impact of Voids in Interconnection Materials
Abstract
4.1 Introduction
4.2 Thermal transfer and thermo-elasticity
4.3 Description of the numerical method
4.4 Simulation of thermal and thermomechanical effects in the interconnection material of an electronic module
4.5 Conclusion
5: Electro-Thermo-Mechanical Modeling
Abstract
5.1 Introduction
5.2 Theory of electro-thermo-mechanical coupling
5.3 Simulation of electro-thermo-mechanical behavior using the finite element method
5.4 Example of an electro-thermo-mechanical simulation of an HBT transistor
5.5 Modal analysis of mechanical components
5.6 Stochastic modal analysis of structures
5.7 Numerical identification of the elastic parameters of electronic components
5.8 Example of modeling and simulation of the vibratory behavior of mechatronic components
5.9 Conclusion
5.10 List of abbreviations and symbols
6: Meta-Model Development
Abstract
6.1 Introduction
6.2 Definition of a meta-model
6.3 Selection of factors: screening
6.4 Creation of designs of experiments
6.5 Modeling of the response surface: PLS regression and Kriging
6.6 Sensitivity analysis of the model: variance decomposition, Sobol criterion
6.7 Robust design
6.8 Conclusion
7: Probabilistic Study and Optimization of a Solder Interconnect
Abstract
7.1 Introduction
7.2 Electronic equipment
7.3 Thermal modeling of the electronic board
7.4 Probabilistic study of the effect of thermomechanical stresses on a solder joint
7.5 Optimization of the solder joint
7.6 Conclusion
8: High-Efficiency Architecture for Power Amplifiers
Abstract
8.1 Introduction
8.2 Main reliability parameters
8.3 Methodology
8.4 Aging tests
8.5 Other results
8.6 Origin of degradations: discussion
8.7 Physical analysis
8.8 Amplifier design rules
8.9 Conclusion
9: Reliability Analysis based on Metamodels of Chip-Scale Packages (CSP)
Abstract
9.1 Introduction
9.2 Description of the CSP packaging
9.3 Metamodeling and reliability analysis
9.4 Probabilistic analysis of the reliability of CSP assemblies
9.5 Conclusion

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