3D and Circuit Integration of MEMS 1st Edition Masayoshi Esashi

3D and Circuit Integration of MEMS – Ebook Instant Download/Delivery ISBN(s): 9783527346479,9783527823246,9783527823239,3527346473,3527823247,3527823239

Product details:

• ISBN-10 ‏ : ‎ 3527346473
• ISBN-13 ‏ : ‎ 978-3527346479
• Author(s): Masayoshi Esashi

3D and Circuit Integration of MEMS

Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems

MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration.

You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks.

Table contents:

Part I: Introduction
1 Overview
Part II: System on Chip
2 Bulk Micromachining
3 Enhanced Bulk Micromachining Based on MIS Process
4 Epitaxial Poly Si Surface Micromachining
5 Poly-SiGe Surface Micromachining
6 Metal Surface Micromachining
7 Heterogeneously Integrated Aluminum Nitride MEMS Resonators and Filters
8 MEMS Using CMOS Wafer
9 Wafer Transfer
10 Piezoelectric MEMS
Part III: Bonding, Sealing and Interconnection
11 Anodic Bonding
12 Direct Bonding
13 Metal Bonding
14 Reactive Bonding
15 Polymer Bonding
16 Soldering by Local Heating
17 Packaging, Sealing, and Interconnection
18 Vacuum Packaging
19 Buried Channels in Monolithic Si
20 Through-substrate Vias

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