Handbook of Silicon Based MEMS Materials and Technologies 3rd Edition – Ebook Instant Download/Delivery ISBN(s): 9780128177860,0128177861,9780128177877, 012817787X

Product details:

• ISBN-10: 012817787X
• ISBN-13: 9780128177877
• Author: Markku Tilli, Mervi PaulastoKröckel, Matthias Petzold

Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures.

Table contents:

Part I

1. Properties of silicon; Fracture toughness

2. Czochralski Growth of Silicon Crystals

3. Properties of Silicon Crystals

4. Silicon Wafers: Preparation and Properties; Modern technologies

5. Epi Wafers: Preparation and Properties

6. Thin Films on Silicon

6.1 Thin Films on Silicon: Silicon Dioxide

6.2 Thin Films on Silicon: Silicon Nitride

6.3 Thin Films on Silicon: Poly-SiGe for MEMS-Above-CMOS Applications and Poly-Si

6.4 Thin Films on Silicon:

6.5 Thin Films on Silicon: Piezoelectric Thin Film Materials for MEMS,

6.6 Black Silicon

6.7 Thin films for Anti-stiction

7. Thick-Film SOI Wafers: Preparation and properties

Part II

8. Multiscale Modeling Methods

9. Mechanical Properties of Silicon Microstructures

10. Electrostatic and RF-Properties of MEMS Structures

11. Optical Modeling of MEMS

12. Modeling of Silicon Etching

13. Gas Damping in Vibrating MEMS Structures

14. Recent Progress in Large-scale Electronic State Calculations and Data-driven Sciences

Part III

15. MEMS Lithography

16. Deep Reactive Ion Etching; update

17. Wet Etching of Silicon

18. Porous Silicon Based MEMS

19. Surface Micromachining

20. Vapor Phase Etch Processes for Silicon MEMS

21. Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS

22. Microfluidics and BioMEMS in Silicon

Part IV

23. Silicon Direct Bonding

24. Anodic Bonding

25. Glass Frit Bonding

26. Metallic Alloy Seal Bonding

27. Emerging Wafer Bonding Technologies

28. Bonding of CMOS Processed Wafers

29. Wafer-Bonding Equipment

30. Encapsulation by Film Deposition

31. Dicing of MEMS Devices

32. 3D Integration of MEMS

33. Own chapter for eWLP

34. Through-Substrate Via Technologies for MEMS

35. Outgassing and Gettering

Part V

36. Silicon Wafer and Thin Film Measurements

37. Oxygen and Bulk Microdefects in Silicon

38. Optical Measurement of Static and Dynamic Displacement in MEMS

39. MEMS Residual Stress Characterization: Methodology and Perspective

40. Microscale deformation analysis

41. Strength of Bonded Interfaces

42. Hermeticity Tests

43. MEMS testing and calibration

44. MEMS Reliability

Part VI

45. Case Accelerometer

46. Case Gyroscope

47. Case Pressure Sensor

48. Case Microphone

49. Case Micromirror

50. Case Optical MEMs

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