High Power Impulse Magnetron Sputtering Fundamentals Technologies Challenges and Applications 1st Edition by Daniel Lundin 012812455 9780128124550

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ISBN-10 ‏ : ‎012812455 

ISBN-13 ‏ : ‎9780128124550

Author:   Daniel Lundin 

High Power Impulse Magnetron Sputtering: Fundamentals, Technologies, Challenges and Applications is an in-depth introduction to HiPIMS that emphasizes how this novel sputtering technique differs from conventional magnetron processes in terms of both discharge physics and the resulting thin film characteristics. Ionization of sputtered atoms is discussed in detail for various target materials. In addition, the role of self-sputtering, secondary electron emission and the importance of controlling the process gas dynamics, both inert and reactive gases, are examined in detail with an aim to generate stable HiPIMS processes.

High Power Impulse Magnetron Sputtering: Fundamentals, Technologies, Challenges and Applications 1st Table of contents:

1: Introduction to magnetron sputtering
Abstract
1.1. Fundamentals of sputtering
1.2. Magnetron sputtering
1.3. Magnetron sputtering configurations
1.4. Pulsed magnetron discharges
References
2: Hardware and power management for high power impulse magnetron sputtering
Abstract
2.1. Brief history of high power pulsed magnetron sputtering
2.2. Pulse generators
2.3. Substrate bias
2.4. Advanced HiPIMS configurations
References
3: Electron dynamics in high power impulse magnetron sputtering discharges
Abstract
3.1. Techniques for characterizing plasma electrons
3.2. Fundamental electron characteristics
3.3. Influence of target material and working gas
3.4. Multiple sources and hybrid systems
References
4: Heavy species dynamics in high power impulse magnetron sputtering discharges
Abstract
4.1. The plasma ions
4.2. The plasma neutrals
References
5: Modeling the high power impulse magnetron sputtering discharge
Abstract
5.1. Modeling approaches
5.2. Important modeling results
References
6: Reactive high power impulse magnetron sputtering
Abstract
6.1. Introduction to reactive sputter deposition
6.2. Fundamentals of reactive sputtering
6.3. Hysteresis in reactive HiPIMS
6.4. Important aspects of reactive HiPIMS
References
7: Physics of high power impulse magnetron sputtering discharges
Abstract
7.1. The discharge current
7.2. Discharge modes
7.3. Transport of charged particles
7.4. Plasma Instabilities
7.5. Deposition rate
References
8: Synthesis of thin films and coatings by high power impulse magnetron sputtering
Abstract
8.1. Introduction to the fundamentals of thin film growth
8.2. Deposition on complex-shaped substrates
8.3. Interface engineering
8.4. Thin film microstructure and morphology
8.5. Stress generation and evolution
8.6. Phase composition
8.7. Time-domain effect of HiPIMS on film growth
8.8. Summary

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Tags: High Power, Magnetron Sputtering, Fundamentals, Technologies, Challenges, Applications