Lead-free Soldering Process Development and Reliability 1st Edition

Lead-free Soldering Process Development and Reliability 1st Edition- Ebook Instant Download/Delivery ISBN(s): 9781119482031,1119482038,9781119481935, 1119481937

Product details:

• ISBN 10: 1119481937
• ISBN 13: 9781119481935
• Author: Jasbir Bath

Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production.

Table contents:

1 Lead‐Free Surface Mount Technology

2 Wave/Selective Soldering

3 Lead‐Free Rework

4 Solder Paste and Flux Technology

5 Low Temperature Lead‐Free Alloys and Solder Pastes

6 High Temperature Lead‐Free Bonding Materials – The Need, the Potential Candidates and the Challenges

7 Lead (Pb)‐Free Solders for High Reliability and High‐Performance Applications

8 Lead‐Free Printed Wiring Board Surface Finishes

9 PCB Laminates (Including High Speed Requirements)

10 Underfills and Encapsulants Used in Lead‐Free Electronic Assembly

11 Thermal Cycling and General Reliability Considerations

12 Intermetallic Compounds

13 Conformal Coatings

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