(EBook PDF) Materials and Processes for Next Generation Lithography 1st Edition by Alex Robinson, Richard Lawson 0081003587 9780081003589 full chapters

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Product details:

ISBN-10 :  0081003587 

ISBN-13 : 9780081003589

Author: Alex Robinson, Richard Lawson 

As the requirements of the semiconductor industry have become more demanding in terms of resolution and speed it has been necessary to push photoresist materials far beyond the capabilities previously envisioned. Currently there is significant worldwide research effort in to so called Next Generation Lithography techniques such as EUV lithography and multibeam electron beam lithography.

These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches.

 

Materials and Processes for Next Generation Lithography 1st Table of contents:

Chapter 1. Overview of materials and processes for lithography
1.1. Introduction
1.2. Overview of Lithography Process
1.3. Lithographic Exposure Sources and Processes
1.4. Characterization and Figures of Merit for Resists
1.5. Resist Materials and Chemistry
1.6. Challenges in Modern Resist Design
1.7. Conclusions
Chapter 2. Molecular excitation and relaxation of extreme ultraviolet lithography photoresists
2.1. Introduction
2.2. Extreme Ultraviolet Molecular Excitation
2.3. Extreme Ultraviolet Molecular Relaxation
2.4. Extreme Ultraviolet Processes in Condensed Films
2.5. Outlook and Conclusions
Chapter 3. Theory: Electron-induced chemistry
3.1. Introduction
3.2. Mechanisms for Electron-Induced Reactions
3.3. Potential Role in Lithography
3.4. Conclusions
Chapter 4. EUV lithography process challenges
4.1. Introduction
4.2. EUV-IL as a Characterization and Nanopatterning Tool
4.3. Resist Material Challenges
4.4. Conclusions
Chapter 5. EUV lithography patterning challenges
5.1. Extreme Ultraviolet Lithography: Pushing Optical Lithography to the Extreme
5.2. Extreme Ultraviolet Resist Stochastics
5.3. Extreme Ultraviolet Resist Progress, a Historical Perspective
Chapter 6. The chemistry and application of nonchemically amplified (non-CA) chain-scission resists
6.1. Introduction
6.2. The Ceiling Temperature
6.3. The Chemistry of Specific Polymer Resist Systems
6.4. Summary
Chapter 7. Chemically amplified resists and acid amplifiers
7.1. Extreme Ultraviolet Resists
7.2. EUV CAR Resists
7.3. Conclusion
Chapter 8. Negative-tone organic molecular resists
8.1. Introduction
8.2. Fullerene Resists
8.3. Triphenylene Resists
8.4. Calixarene Resists
8.5. Noria Resists
8.6. Polyphenol Resists
8.7. Cationic Polymerization and Cross-linking
8.8. Other Resists
8.9. Summary
Chapter 9. Positive molecular resists
9.1. Introduction
9.2. General Characteristics
9.3. Molecular Resist Families
9.4. Current Status, New Concepts, and Challenges
9.5. Conclusions
Chapter 10. Mainstreaming inorganic metal-oxide resists for high-resolution lithography
10.1. Metal-Oxide Resists
10.2. Hydrogen Silsesquioxane
10.3. High-Z Nanocluster Patterning
10.4. Metal-Oxide Nanocluster Patterning Materials—Present and Future
Chapter 11. Molecular organometallic resists for EUV (MORE)
11.1. Introduction
11.2. Survey of Simple Metal Complexes
11.3. Bismuth Compounds
11.4. Palladium and Platinum Compounds
11.5. Tin Compounds
11.6. Metal Oxalate Complexes
11.7. Conclusions
Chapter 12. SML electron beam resist: Ultra-high aspect ratio nanolithography
12.1. Introduction
12.2. Photomask Production
12.3. Electron Beam Resist Optical Properties
12.4. SML2000 Electron Beam Performance
12.5. Pushing the Resolution Limits
12.6. Summary
Chapter 13. Alternative resist approaches
13.1. Introduction
13.2. Novel Approaches for EUV
13.3. Conclusions
Chapter 14. Next generation lithography—the rise of unconventional methods?
14.1. The Ultimate Driving Force: Moore’s Law
14.2. Beyond Optical: State-of-the-art in NGL
14.3. Beyond Scaling—Post Si-MOSFET/CMOS Technology
Chapter 15. Tip-based nanolithography methods and materials
15.1. Scanning Probe Lithography
15.2. Scanning Probe Lithography Classification
15.3. Increasing the Efficiency and Throughput of Scanning Probe Lithography
15.4. Conclusion
Chapter 16. Thermal scanning probe lithography
16.1. History
16.2. Advantages of Thermal Scanning Probe Lithography
16.3. Patterning With Thermal Scanning Probe Lithography
16.4. Pattern Transfer Processes From PPA
16.5. Conclusions
Chapter 17. Scanning helium ion beam lithography
17.1. Introduction
17.2. Helium Ion Beam System and Ion Solid Interactions
17.3. Exposure of Resists in Helium Ion Beam Lithography
17.4. Conclusions and Outlook

 

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