Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore

Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore – Ebook Instant Download/Delivery ISBN(s): 9780081025321,9780081025338,0081025327,0081025335

Product details:

• ISBN 10:9780081025338
• ISBN 13:0081025335
• Author:Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao
  

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

Table contents:

1. Introduction

2. Electrical modeling and design

3. Thermal modeling, analysis, and design

4. Stress and reliability analysis for interconnects

5. Reliability and failure analysis of encapsulated packages

6. Thermal and mechanical tests for packages and materials

7. System-level modeling, analysis, and design

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